International collaboration EU and Japan on semiconductors

Expected Outcome: Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.

Amount: €3M — €5M
Type: Grant

Key facts

Key facts for International collaboration EU and Japan on semiconductors
Amount	€3M — €5M — €5M shared across the programme
Issuer	Digital Europe Programme
Who can apply	EU companies
Sectors	Deep tech
Deadline	Closed 24 Sep 2026

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Update history

Source: ec.europa.eu ↗

Source checked 21 hours ago

8 days agoagentImported from the official source

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