International collaboration EU and Japan on semiconductors

This grant funds projects that develop advanced heterogeneous integration such as 2.5D/3D packaging and integrated photonics for AI, and create standardized chiplet interfaces to enable a dynamic ecosystem. It supports work at Technology Readiness Levels 5-7 that moves from lab to pilot and includes knowledge transfer through workshops, publications and networking.

Amount: €3M — €5M
Type: Grant

Key facts

Key facts for International collaboration EU and Japan on semiconductors
Amount	€3M — €5M — €5M shared across the programme
Issuer	Digital Europe Programme
Who can apply	See eligibility details
Sectors	Deep Tech
Deadline	Closes 08 Dec 2026

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Update history

Source: ec.europa.eu ↗

Source checked 17 hours ago

53 days agoagentImported from the official source

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